Eurofins MASER – Failure Analysis
We offer a wide variety of Failure Analysis (FA) to a wide range of customers within the electronics industry. For a successful FA a combination of good equipment and skilled engineers/technicians is key. Throughout the years we have continuously extended our equipment capability to keep pace with the modern day technology developments. Importantly, our staffing has similarly grown in size, experience and skills. Having this capability in a centralized lab is unique in Europe and our extensive offering and FA outcome is highly appreciated by our customers. For a full scope of our possibilities please see the summary below.
Failure Analysis Services
Non Destructive Analysis
- (3D) Optical Microscopy
- X-ray Analysis (2D & 3D)
- Scanning Acoustic Microscopy (SAM)
- (3D) Lock-in Thermography (LIT)
Construction Analysis
- Full knowledge of requirements in ESCC, PEM-INST and MIL standards
- Latest toolsets available
- Full custom reporting on request
- Certificate of Conformity (CoC) on request
FIB Circuit Edit
- Decapsulation and re-encapsulation
- GDS based navigation
- Front & backside edits
- Low resistance metal deposition
- Insulator deposition
- Support for all IC processes
IPC inspection
- Optical Microscopy to check PCBA surface
- X-ray Analysis
- Mechanical Cross Sectioning by precision sawing/grinding and polishing
- SEM inspection and EDX material analysis
- A comprehensive report containing all findings
Advanced Failure Analysis
- Curve tracing - measure the I/V curves
- Decapsulation - remove covering materials to get access to a chip surface
- Conventional Cross-sectioning - molding and polishing to reach the area of interest
- De-layering - layer by layer removal by fine polishing or etching to reach the area of interest
- Micro-probing - on-chip measurement of voltages
- Optical Microscopy - using light to make images at magnifications up to 1000x
- Scanning Electron Microscopy (SEM) - using focused electrons for imaging and analysis purposes
- Emission Microscopy - locating emitted photons on semiconductors
- Optical Beam Induced Resistance Change (OBIRCH)- locating resistance changes due to heating with a scanning laser
- Lock-in thermography (LIT) - locating hot spots on semiconductors or on modules
- Atomic Force Microscopy (AFM) - leakage measurements by surface scanning
- Focused Ion Beam Cross Sectioning - using ions to precisely remove material
In case of any questions or request please contact sales@maser.nl or visit our website for more information (https://www.maserengineering.eu/).
